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tin whisker observation and measurement

background:

tin whisker is the tin crystallization of the elongated shape which spontaneously grows from the coating surface of pure tin or tin alloy. in electronic circuits, tin whisker will cause a short circuit, reduce the reliability of electronic components, even lead to breakdown or failure of electronic components. the tin whisker usually begin to grow after a few years or even decades of electroplating, which may cause large potential harm on the reliability of the product .

for environmental and human health, china, japan, the european union, the united states and other countries have issued relevant regulations or laws expressly restrict or prohibit the use of lead in electronic and electrical equipments, making electronic products lead free. the electronics industry lead-free trend, means that the most widely used sn-pb solder in the electronics industry will become history. at the same time, the widely used sn-pb will be replaced by new metal or alloy. the study shows that, as possible replacement, pure sn, sn-bi, sn-ag-cu, all these metal or alloy have the potential problem of the spontaneous growth of tin whiskers.

application range:

electronic component, automotive electronic, medical, communication, mobile phone, computer, electrical, etc.

tested flow：

after sputtering pt on surface, the tested samples will be put into sem vacuum chamber to observe and measure according to standard sem operation procedure.

reference standard：

jesd 22a121.01 test method for measuring whisker growth on tin and tin alloy surface finishes

jesd201a environmental acceptance requirements for tin whisker susceptibility of tin and tin alloy surface finishes

iec 60068-2-82-2009 environmental testing - part 2-82: whisker test methods for electronic and electric components

typical pictures: