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thermal conductivity

1. the steady-state heat flow method

scope of application: applicable to homogeneous and heterogeneous electric insulation of thermal conductivity of the thermal interface materials of equivalent heat transfer coefficient and thermal impedance test, such as: thermal conductive paste, thermal conductivity, heat conduction glue, interface material, phase change material, ceramic, metal, base plate, aluminum plate, copper base board, soft board, etc. measuring range: the coefficient of thermal conductivity 0.1 ~ 20 w/(m • k), thermal impedance > 0.01 ℃, w/cm2

reference standard：

astm d5470-12 thermal conductivity electrical insulation heat transfer characteristics of the standard test methods

sample requirements:

steady state method usually require sample homogeneous structure, dry, flat, smooth surface. solid sample size requirements: < 27 mm x 27 mm, thickness 5 mm

test case

2. laser indeed method (lfa)

laser indeed method can be applied to a wide range of materials, including graphite, metal, ceramics, polymers, composite materials, such as wide range of measuring temperature (room temperature to 500 ℃), the measurement range of 0.1 ~ 2000 w/(m • k). this method is a non-contact and non-destructive measurement technology, with a simple sample preparation, the required sample size is small, measuring speed, numerous advantages of higher accuracy. not only can accurately measure the thermal diffusion coefficient directly, can also be multiplied by the density and specific heat capacity of samples, coefficient of thermal conductivity calculation.

reference standard：

astm e1461-13 test method for determination of thermal diffusivity by flash method

sample requirements:

samples of internal should be uniform, parallel to the surface must be smooth, uniform thickness.

test case